Conductive Epoxy Manual Wire Bonding
Manually adjust micro-positioners with reversible tweezers to move bond wires with conductive epoxy into position. The epoxy can be cured at ambient temperature or in an oven. See our application note on conductive epoxy wire-bonding and the conductive epoxy wire-bonder kit datasheet.
We made a manual wire bonder to prep samples that can be mounted in any orientation normal to the sample top down(0 degrees) or cross-sectional imaging (90 degrees). You can have very close working distances and have an electrical contact from your device to the chip carrier. Sample prep can be done in advance and tested outside of the SEM.
We recommend H22 and E2101 conductive epoxies from Epotek both meet NASA low outgassing requirements. Our conductive epoxy wire-bonder kit is available in our webstore
